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AmDynamic Bond
Kuala Lumpur, Malaysia
AmDynamic Bond, Kuala Lumpur, Malaysia · LEI: 2549005WBI113BDM5R83 · Forma companiei: 8888 · Stare: LAPSED. Free company profile — no paywall, no login
FAQ — AmDynamic Bond
- What is the LEI of AmDynamic Bond?
- The Legal Entity Identifier (LEI) of AmDynamic Bond is 2549005WBI113BDM5R83.
- Where is AmDynamic Bond registered?
- AmDynamic Bond are adresa înregistrată în Kuala Lumpur, Malaysia.
- Extrasul de registru al AmDynamic Bond este gratuit?
- Yes. Eulerpool provides all company register data — including the complete record of AmDynamic Bond — completely free of charge, with no login required.
Official registry record
Extrasul complet al registrului oficial — fiecare câmp din LEI / registrul companiilor, gratuit, fără autentificare.
| legal_name | AmDynamic Bond |
|---|---|
| legal_city | Kuala Lumpur |
| legal_jurisdiction | MY |
| lei | 2549005WBI113BDM5R83 |
| entity_category | FUND |
| entity_legal_form_code | 8888 |
| legal_first_address_line | 9th Flr Banagunan AmBankGroup |
| legal_additional_address_line | 55 Jalan Raja Chulan |
| legal_postal_code | 50200 |
| headquarters_first_address_line | c/o AmFunds Management Berhad |
| headquarters_additional_address_line | 9th Flr Banagunan AmBankGroup |
| headquarters_city | Kuala Lumpur |
| headquarters_postal_code | 50200 |
| next_renewal_date | 21.08.2023 |
| last_update_date | 21.08.2023 |
| managing_lou | 5493001KJTIIGC8Y1R12 |
| registration_status | LAPSED |
| validation_sources | ENTITY_SUPPLIED_ONLY |